The Thermal Grizzly Intel 1851 Contact Frame is a precision-engineered mounting aid for Intel mainboards featuring the LGA1851 socket. Designed to replace the stock ILM, it enhances contact pressure distribution, improving CPU cooling performance and stability during extreme overclocking. Crafted from anodised aluminium, this high-performance solution is simple to install
Features
Intel 1851 CPU Contact Frame V1
High Performance Cooling Solutions – Made in Germany
The Intel 1851 CPU Contact Frame V1 replaces the stock ILM of the motherboard, ensuring even pressure on the CPU when mounted in the socket. The frame’s inner contour has been adjusted to fit processors designed for the 1851 socket. Installation of the contact frame is user-friendly as it does not require specific torque when screwing it in place.
The Intel 1851 CPU Contact Frame V1 protects the CPU during frequent installations and enhances temperatures and memory clock stability during extreme overclocking.
- Lower CPU temperatures
- Easy assembly
- High compatibility
- Anodised aluminium
Why Use a Contact Frame?
The standard Integrated Loading Mechanism (ILM) has contact points located in the centre of the elongated CPU. As a result, uneven contact pressure causes the surface of the Integrated Heat Spreader (IHS) to bend concavely. This means the CPU cooler primarily makes contact with the edges of the IHS, leaving the thermal “hotspot” of the CPU not optimally covered.
The Intel 1851 CPU Contact Frame V1 features a special inner contour that shifts the contact pressure from the centre of the CPU to the edges during installation, preventing the concave bending of the IHS. This allows the CPU cooler to sit better on the processor, creating a larger contact area to dissipate the CPU’s heat. Since the thermal centre of Arrow Lake processors has shifted to the upper third of the processor, a level surface is particularly important.
The installation of the contact frame is simple and can be completed in just a few steps. Depending on the CPU cooler used and the specific CPU, processor temperatures can be noticeably reduced.
With ILM
With Intel 1851 CPU Contact Frame V1
The Intel 1851 CPU Contact Frame V1 in Action
At an XOC event in Taipei, Taiwan, hosted by ASUS as a pre-launch event in late September 2024, the Intel 1851 CPU Contact Frame V1 was tested. The renowned Overclocked Gaming Systems (OGS) team from Greece consistently achieved 33-50 MHz higher clock speeds using the Intel 1851 CPU Contact Frame V1 in conjunction with liquid nitrogen (LN2).
In everyday use, temperature improvements of 0 to 6 degrees Celsius can be achieved when replacing the standard ILM with the Intel 1851 CPU Contact Frame V1. When replacing the Reduced Load ILM (RL-ILM) found on some socket 1851 motherboards, additional temperature reductions of up to 3°C can be achieved.
Compatibility
The Intel 1851 CPU Contact Frame V1 is compatible with Intel Core Ultra 200 processors for the LGA1851 socket. The frame is also only compatible with CPUs that have an Integrated Heat Spreader (IHS) ground down by no more than 0.2 millimetres. When mounting, it is important to ensure that no electronic components are located beneath the frame, especially with Mini-ITX form factor motherboards.
